AMD: The Latest in AMD Devices and Tools
In this session we will go through the major advances and the newest AMD devices and tools.
For the devices we will look at the new features of the following devices: Artix UltraScale Plus (AUP), Spartan UltraScale Plus (AUP), Versal 2 Advanced System on a Chip (ASoC), X86 devices, both the RYZEN and the EPYC families in both the traditional, and the embedded spaces. For the tools we will look at the new features of the 2025.1 version of the tool, and the introduction of the Zephyr RTOs.
Avnet: Designing with Supply Chain in Mind: Empowering Engineers for Smarter Product Development
In today’s global landscape, product innovation is only as strong as the supply chain behind it. This engaging panel discussion, led by David Paulson, Global Vice President of Avnet Velocity, will explore how design engineers can drive competitive advantage by integrating supply chain considerations early in the development process. Joined by Field Application Engineer Paul Schoenke and other supply chain leaders, the panel will share real-world insights on how factors like component availability, lifecycle risk, and geopolitical disruptions impact design decisions. Learn how cross-functional collaboration between engineering and supply chain can lead to more resilient, scalable, and cost-effective product solutions.
Avnet: The Edge Awakens: Engineering AI for a Smarter, Localized Future with Avnet
AI is accelerating into the embedded world, powered by the emergence of NPUs built into microprocessors and microcontrollers. What was once reserved for data scientists and developers working in the cloud is now reaching embedded engineers at the edge. In this session, we will examine why this shift is happening and what it means for embedded design, covering topics such as model optimization, power efficiency, memory constraints, and real-time inferencing. Suppliers like AMD, NXP, Renesas, Infineon, and STMicroelectronics are introducing revolutionary technologies that will soon become commonplace. Avnet is supporting this transformation with guidance, software resources, engineering expertise, education, services, and IoT solutions to help teams move from concept to deployment. The technology is ready. The expectations are already here. Now it is time for embedded engineers to take the lead.
Broadcom: Industrial Automation Sensors
Learn more about Broadcom’s Industrial Products portfolio. A brief overview of Broadcom’s isolation, industrial fiber and optical sensing solutions including optical power converters, time of flight sensors, optical wireless communication, SiPMs and spectrometers.
Infineon: Untapping GAN and SiC for the Motor Control World
Learn how Infineon is leveraging their expertise in wide bandgap semiconductors, combined with their newly released PSOC Control microcontrollers, to advance motor control. We will go into the newest product and packaging solutions along with how to solve the challenges of designing for these new technologies using digital control.
Molex: The Power Shift: Advancing Molex Transportation Technologies
The transportation industry is undergoing a transformative shift towards enhanced efficiency, reliability, and sustainability, with Molex technologies playing a pivotal role. Innovations in power delivery and signal connectivity are essential for modern vehicles, offering efficient performance and seamless communication across networks to advance data management and vehicle intelligence. Electrification impacts more than the powertrain, and Molex connector solutions are designed for ease of integration into various vehicle architectures, supporting applications like infotainment systems, powertrain components, and safety features. Their ability to maintain secure connections under demanding conditions is crucial for the increasingly complex electronic systems in vehicles. These technologies empower manufacturers to develop cutting-edge transportation solutions, driving the industry towards a smarter, more connected future by meeting the growing demands for efficiency, safety and sustainability.
NXP: Scalable 48-1200V BMS and X-in-1 Electrification Solutions supporting SDV, Zonal Actuation, OBC, DCDC and Edge AI
During this presentation users will learn about NXP’s 5 x BMS reference designs including our upcoming 48V BMS technology and X-in-1 platform supporting BMS, Zone controlled Motor Control for SDV, OBC, DCDC and Edge-AI enabled by eIQ Auto Software.
onsemi: BLDC Applications: Battery Powered (Industrial) and MHEV 48V
This course will begin with a brief tutorial on Li-ion, and then move into a technical deep dive into onsemi’s selection of gate drivers, PowerTrench MOSFETs and isense for BLDC (Brushless DC Motor) applications up to 15S. These applications include power tools, riding lawn mowers, drones, Autonomous Mobile Robots (AMR), forklifts, e-bikes, golf carts, and snow mobiles, to name a few. We also will explore MHEV (Mild Hybrid Electric Vehicle) applications where we examine onsemi’s gate drivers, PowerTrench MOSFETs, IPM modules and isense for 48V BLDC.
Renesas: Navigate Wireless Connectivity with Ease: Renesas Solutions for Wi-Fi, Bluetooth NFC, and More
No "MATTER" how challenging it is to "THREAD" through the vast array of wireless connectivity options, let Renesas "CRUISE" you through our ecosystem of easy-to-use software and modules. From quick start to full development platforms and system solutions, we support Wi-Fi, Bluetooth, NFC, and beyond. Protect your "ASSET" from getting lost at sea and "FIND" your way through a seamless journey with Renesas.
STMicroelectronics: Accelerating Edge AI with ST Micro's STM32N6 and Edge AI Tool Suite
This training course will introduce developers to STMicro’s Edge AI Tool Suite, featuring the powerful new STM32N6 MCU with neural processing capabilities. Participants will experience starting a project with machine learning models for edge devices with ST’s integrated toolchain and be introduced to developing models, deploying to the cloud and a variety of other functions ST provides to customers for free!
Tria: Qualcomm Edge AI: The Unique Balance of Performance and Power for Edge AI Applications
Deploying edge AI solutions often requires a balance of high-performance compute with the power, thermal and size constraints of embedded systems. Qualcomm has long understood these challenges with their leadership in the mobile and automotive space and is now expanding its support for the industrial segment. This course will introduce you to the new Qualcomm Dragonwing™-based modules and Vision AI-Kit solutions from Tria Technologies, providing insights into development flows, OS support and software enablement, especially in the context of vision-AI industrial applications. With up to 100 TOPS of AI acceleration, these scalable platforms leverage a common development flow that can accelerate your time to market. Instructor-led demos will illustrate inference, compute performance, power efficiency and real-time profiling measurement for different AI models and use-cases in this informative and interactive session.
